The NXP EdgeLock A30, smaller than a grain of rice, protects digital data from tampering, aiding future EU digital product passport requirements.

A landmark $1.2 billion in direct funding to support the semiconductor industry is coming to Tempe in two grants announced ...

Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form ...

Browse 2,100+ chip wafer stock videos and clips available to use in your projects, or search for silicon chip wafer to find more stock footage and b-roll video clips. close up of asian male technician ...

We recently published a list of 10 AI Stocks on Wall Street’s Radar. In this article, we are going to take a look at where ...

system‐in‐package and chip‐on‐wafer‐on‐substrat, integrated fan‐out in packaging. In the path of past development, small‐scale integration has been named in the early 1960s; it has around tens of ...

Some possible package types include: Advanced flip-chip packages 3D-stacked die packages Wafer-level chip-scale packages Interposer-based packages These packages are placed into the same assembly as ...

RRP Electronics is already working on the production of sophisticated Application-Specific Integrated Circuits (ASICs) in QFN ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding ... Now, imec exploited the III-V nano-ridge engineering concept to demonstrate the ...

Further benefits of this technology include the cost — it uses a $50 diode, and employs a cost-effective and scalable fabrication process that is created using a CMOS compatible wafer scale process ...