https://www.masterbond.com › underfill › encapsulants
赞助Master Bond’s epoxy underfill compositions offer excellent underfill to die passivation. Low viscosity epoxy underfill encapsulants for hi-tech electronic applications. B2B only.
B2B Adhesive Experts · Free quotes for B2B · Factory direct · 40 years in business
Service catalog: Aerospace Adhesives, Medical Adhesives, Adhesives for Electronics